METHOD FOR OPTIMIZING A SAMPLING SCHEME AND ASSOCIATED APPARATUSES
Disclosed is a method and associated apparatuses for optimizing a sampling scheme which defines sampling locations on a bonded substrate, having undergone a wafer to wafer bonding process. The method comprises determining a sampling scheme for a metrology process and optimizing the sampling scheme w...
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| creator | TEN BERGE, Peter HENKE, Wolfgang ROY, Sarathi |
| description | Disclosed is a method and associated apparatuses for optimizing a sampling scheme which defines sampling locations on a bonded substrate, having undergone a wafer to wafer bonding process. The method comprises determining a sampling scheme for a metrology process and optimizing the sampling scheme with respect to a singularity (SG) defined by a large overlay error and/or grid deformation at a central location on the bonded substrate to obtain a modified sampling scheme.
L'invention concerne un procédé et des appareils associés pour optimiser un schéma d'échantillonnage qui définit des emplacements d'échantillonnage sur un substrat lié, ayant subi une opération de collage tranche à tranche. Le procédé comprend la détermination d'un schéma d'échantillonnage pour un processus de métrologie et l'optimisation du schéma d'échantillonnage par rapport à une singularité (SG) défini par une erreur de superposition et/ou une déformation de grille importantes au niveau d'un emplacement central sur le substrat lié pour obtenir un schéma d'échantillonnage modifié. |
| format | Patent |
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L'invention concerne un procédé et des appareils associés pour optimiser un schéma d'échantillonnage qui définit des emplacements d'échantillonnage sur un substrat lié, ayant subi une opération de collage tranche à tranche. Le procédé comprend la détermination d'un schéma d'échantillonnage pour un processus de métrologie et l'optimisation du schéma d'échantillonnage par rapport à une singularité (SG) défini par une erreur de superposition et/ou une déformation de grille importantes au niveau d'un emplacement central sur le substrat lié pour obtenir un schéma d'échantillonnage modifié.</description><language>eng ; fre</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MATERIALS THEREFOR ; MEASURING ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211202&DB=EPODOC&CC=WO&NR=2021239334A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211202&DB=EPODOC&CC=WO&NR=2021239334A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TEN BERGE, Peter</creatorcontrib><creatorcontrib>HENKE, Wolfgang</creatorcontrib><creatorcontrib>ROY, Sarathi</creatorcontrib><title>METHOD FOR OPTIMIZING A SAMPLING SCHEME AND ASSOCIATED APPARATUSES</title><description>Disclosed is a method and associated apparatuses for optimizing a sampling scheme which defines sampling locations on a bonded substrate, having undergone a wafer to wafer bonding process. The method comprises determining a sampling scheme for a metrology process and optimizing the sampling scheme with respect to a singularity (SG) defined by a large overlay error and/or grid deformation at a central location on the bonded substrate to obtain a modified sampling scheme.
L'invention concerne un procédé et des appareils associés pour optimiser un schéma d'échantillonnage qui définit des emplacements d'échantillonnage sur un substrat lié, ayant subi une opération de collage tranche à tranche. Le procédé comprend la détermination d'un schéma d'échantillonnage pour un processus de métrologie et l'optimisation du schéma d'échantillonnage par rapport à une singularité (SG) défini par une erreur de superposition et/ou une déformation de grille importantes au niveau d'un emplacement central sur le substrat lié pour obtenir un schéma d'échantillonnage modifié.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDydQ3x8HdRcPMPUvAPCPH09Yzy9HNXcFQIdvQN8AExg509XH1dFRz9XBQcg4P9nT0dQ1yBzIAAxyDHkNBg12AeBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhIf7m9kYGRoZGxpbGziaGhMnCoApZcsEg</recordid><startdate>20211202</startdate><enddate>20211202</enddate><creator>TEN BERGE, Peter</creator><creator>HENKE, Wolfgang</creator><creator>ROY, Sarathi</creator><scope>EVB</scope></search><sort><creationdate>20211202</creationdate><title>METHOD FOR OPTIMIZING A SAMPLING SCHEME AND ASSOCIATED APPARATUSES</title><author>TEN BERGE, Peter ; HENKE, Wolfgang ; ROY, Sarathi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021239334A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2021</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TEN BERGE, Peter</creatorcontrib><creatorcontrib>HENKE, Wolfgang</creatorcontrib><creatorcontrib>ROY, Sarathi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TEN BERGE, Peter</au><au>HENKE, Wolfgang</au><au>ROY, Sarathi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR OPTIMIZING A SAMPLING SCHEME AND ASSOCIATED APPARATUSES</title><date>2021-12-02</date><risdate>2021</risdate><abstract>Disclosed is a method and associated apparatuses for optimizing a sampling scheme which defines sampling locations on a bonded substrate, having undergone a wafer to wafer bonding process. The method comprises determining a sampling scheme for a metrology process and optimizing the sampling scheme with respect to a singularity (SG) defined by a large overlay error and/or grid deformation at a central location on the bonded substrate to obtain a modified sampling scheme.
L'invention concerne un procédé et des appareils associés pour optimiser un schéma d'échantillonnage qui définit des emplacements d'échantillonnage sur un substrat lié, ayant subi une opération de collage tranche à tranche. Le procédé comprend la détermination d'un schéma d'échantillonnage pour un processus de métrologie et l'optimisation du schéma d'échantillonnage par rapport à une singularité (SG) défini par une erreur de superposition et/ou une déformation de grille importantes au niveau d'un emplacement central sur le substrat lié pour obtenir un schéma d'échantillonnage modifié.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | METHOD FOR OPTIMIZING A SAMPLING SCHEME AND ASSOCIATED APPARATUSES |
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