CONNECTING STRUCTURES FOR INCLUSION IN INTEGRATED MULTILAYER STRUCTURES

Integrated multilayer structure (100, 200, 240, 280, 400,580, 640, 740, 900, 1300, 1400) comprising: a substrate film (102) comprising electrically substantially insulating material; a circuit design (106, 108, 109) comprising electrically conductive elements (106) provided on the substrate film, sa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SÄÄSKI, Jarmo, HEIKKINEN, Mikko, HÄNNINEN, Ilpo
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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