THERMOPLASTIC MOULDING MATERIALS WITH IMPROVED PROPERTY PROFILE

The invention relates to thermoplastic moulding materials comprising styrene block copolymers and propylene-based copolymers, wherein the SBC polymers comprise a styrene content of 5 to 40% by weight and the backbone of the propylene copolymers has a weight-average molecular weight Mw < 10 000 g/...

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Bibliographische Detailangaben
Hauptverfasser:	LINDNER, Torsten, KIRSCHVINK, Felix, BACH, Sebastijan, HAUCK, Erik, STIEHL, Gabriele, NEU, Christian, SCHWABE, Jeremia, TURNER, Robert
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to thermoplastic moulding materials comprising styrene block copolymers and propylene-based copolymers, wherein the SBC polymers comprise a styrene content of 5 to 40% by weight and the backbone of the propylene copolymers has a weight-average molecular weight Mw < 10 000 g/mol. The thermoplastic moulding materials are suitable for affixing granules due to their melt viscosity and their mechanical properties. L'invention concerne des matières à mouler thermoplastiques comprenant des copolymères séquencés de styrène et des copolymères à base de propylène, les polymères SBC comprenant une teneur en styrène de 5 à 40 % en poids et le squelette des copolymères de propylène ayant une masse moléculaire moyenne en masse Mw < 10 000 g/mol. Les matières à mouler thermoplastiques sont appropriées pour fixer des granules en raison de leur viscosité à l'état fondu et de leurs propriétés mécaniques.