RESIN COMPOSITION FOR DIE CLEANING

Provided is a resin composition for die cleaning including a melamine resin, a filler, an acidic compound, and at least one compound selected from the group consisting of an imide compound having a molecular weight of 500 or less and a urea compound having a molecular weight of 500 or less. The acid...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IWATA, Jun, FUKUNISHI, Youichi, YOSHIMURA, Katsunori
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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