HEAT DISSIPATING PANEL FOR CHIP HEAT DISSIPATION, SERVER HEAT DISSIPATING SYSTEM, AND HEATING APPARATUS

A heat dissipating panel for chip heat dissipation, a server heat dissipating system, and a heating apparatus. One end of the heat dissipating panel is blocked and the other end is provided with a water inlet and a water outlet; the pipes in the heat dissipating panel include: multiple branch water inlet pipes each having one end in communication with the water inlet, and multiple branch water outlet pipes each having one end in communication with the water outlet, the other end of each of the multiple branch water inlet pipes and of each of the multiple branch water outlet pipes being in communication with a connecting pipe; the multiple branch water inlet pipes and the multiple branch water outlet pipes are parallel to one another. The heat dissipating panel has short water paths inside with low resistance, high heat dissipation rate, and can be used for heat dissipation of chips. L'invention concerne un panneau de dissipation de chaleur pour dissipation de chaleur de puce, un système de dissipation de chal