PLASMA DEPOSITION APPARATUS
A plasma deposition apparatus (100) comprising: a plasma chamber (10) for plasma deposition of a chemical on a substrate (200) in the plasma chamber; a thermal energizer (20) to thermally energize the chemical prior to plasma deposition in the plasma chamber; at least one radio frequency (RF) electr...
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| creator | JAYASUNDARA, Herath Mudiyanselage Dilan Gaweshana FERNANDO, Kurukulasooriya Merengiralalage Ranitha Prasanga ARIYASINGHA, Muthunayaka Pathiranehelage Malindu RATNAWEERA, Dilru Roshan THENNAKOON, Thennakoon Mudiyanselage Manoj Pushpa Kumara VITARANA, Ranil Keerthi AMARASENA, Jayalath Pedige Samith Chandima BOTHEJU, Welathanthrige Rajitha Sandaruwan |
| description | A plasma deposition apparatus (100) comprising: a plasma chamber (10) for plasma deposition of a chemical on a substrate (200) in the plasma chamber; a thermal energizer (20) to thermally energize the chemical prior to plasma deposition in the plasma chamber; at least one radio frequency (RF) electrode (30) provided within the plasma chamber to energize by RF the thermally-energized chemical to a plasma state; and a guide screen (40) provided within the plasma chamber between the at least one RF electrode and the substrate to increase turbulence of flow of the chemical in plasma state from the at least one RF electrode to the substrate for deposition on the substrate of the chemical in plasma state with increased turbulence of flow.
L'invention concerne un appareil de dépôt par plasma (100) comprenant : une chambre à plasma (10) pour le dépôt par plasma d'un produit chimique sur un substrat (200) dans la chambre à plasma ; un dispositif d'excitation thermique (20) pour exciter thermiquement le produit chimique avant le dépôt par plasma dans la chambre à plasma ; au moins une électrode radiofréquence (RF) (30) disposée à l'intérieur de la chambre à plasma pour exciter par RF le produit chimique à excitation thermique pour l'amener à l'état de plasma ; et un écran de guidage (40) disposé à l'intérieur de la chambre à plasma entre ladite ou lesdites électrodes RF et le substrat pour augmenter la turbulence de l'écoulement du produit chimique à l'état de plasma entre ladite ou lesdites électrodes RF et le substrat pour un dépôt sur le substrat du produit chimique à l'état de plasma avec une turbulence d'écoulement accrue. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2021126089A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2021126089A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2021126089A13</originalsourceid><addsrcrecordid>eNrjZJAO8HEM9nVUcHEN8A_2DPH091NwDAhwDHIMCQ3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGhkZmBhaWjobGxKkCAOSdIZ0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PLASMA DEPOSITION APPARATUS</title><source>esp@cenet</source><creator>JAYASUNDARA, Herath Mudiyanselage Dilan Gaweshana ; FERNANDO, Kurukulasooriya Merengiralalage Ranitha Prasanga ; ARIYASINGHA, Muthunayaka Pathiranehelage Malindu ; RATNAWEERA, Dilru Roshan ; THENNAKOON, Thennakoon Mudiyanselage Manoj Pushpa Kumara ; VITARANA, Ranil Keerthi ; AMARASENA, Jayalath Pedige Samith Chandima ; BOTHEJU, Welathanthrige Rajitha Sandaruwan</creator><creatorcontrib>JAYASUNDARA, Herath Mudiyanselage Dilan Gaweshana ; FERNANDO, Kurukulasooriya Merengiralalage Ranitha Prasanga ; ARIYASINGHA, Muthunayaka Pathiranehelage Malindu ; RATNAWEERA, Dilru Roshan ; THENNAKOON, Thennakoon Mudiyanselage Manoj Pushpa Kumara ; VITARANA, Ranil Keerthi ; AMARASENA, Jayalath Pedige Samith Chandima ; BOTHEJU, Welathanthrige Rajitha Sandaruwan</creatorcontrib><description>A plasma deposition apparatus (100) comprising: a plasma chamber (10) for plasma deposition of a chemical on a substrate (200) in the plasma chamber; a thermal energizer (20) to thermally energize the chemical prior to plasma deposition in the plasma chamber; at least one radio frequency (RF) electrode (30) provided within the plasma chamber to energize by RF the thermally-energized chemical to a plasma state; and a guide screen (40) provided within the plasma chamber between the at least one RF electrode and the substrate to increase turbulence of flow of the chemical in plasma state from the at least one RF electrode to the substrate for deposition on the substrate of the chemical in plasma state with increased turbulence of flow.
L'invention concerne un appareil de dépôt par plasma (100) comprenant : une chambre à plasma (10) pour le dépôt par plasma d'un produit chimique sur un substrat (200) dans la chambre à plasma ; un dispositif d'excitation thermique (20) pour exciter thermiquement le produit chimique avant le dépôt par plasma dans la chambre à plasma ; au moins une électrode radiofréquence (RF) (30) disposée à l'intérieur de la chambre à plasma pour exciter par RF le produit chimique à excitation thermique pour l'amener à l'état de plasma ; et un écran de guidage (40) disposé à l'intérieur de la chambre à plasma entre ladite ou lesdites électrodes RF et le substrat pour augmenter la turbulence de l'écoulement du produit chimique à l'état de plasma entre ladite ou lesdites électrodes RF et le substrat pour un dépôt sur le substrat du produit chimique à l'état de plasma avec une turbulence d'écoulement accrue.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LAUNDERING ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TEXTILES ; TREATMENT OF TEXTILES OR THE LIKE ; TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210624&DB=EPODOC&CC=WO&NR=2021126089A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210624&DB=EPODOC&CC=WO&NR=2021126089A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JAYASUNDARA, Herath Mudiyanselage Dilan Gaweshana</creatorcontrib><creatorcontrib>FERNANDO, Kurukulasooriya Merengiralalage Ranitha Prasanga</creatorcontrib><creatorcontrib>ARIYASINGHA, Muthunayaka Pathiranehelage Malindu</creatorcontrib><creatorcontrib>RATNAWEERA, Dilru Roshan</creatorcontrib><creatorcontrib>THENNAKOON, Thennakoon Mudiyanselage Manoj Pushpa Kumara</creatorcontrib><creatorcontrib>VITARANA, Ranil Keerthi</creatorcontrib><creatorcontrib>AMARASENA, Jayalath Pedige Samith Chandima</creatorcontrib><creatorcontrib>BOTHEJU, Welathanthrige Rajitha Sandaruwan</creatorcontrib><title>PLASMA DEPOSITION APPARATUS</title><description>A plasma deposition apparatus (100) comprising: a plasma chamber (10) for plasma deposition of a chemical on a substrate (200) in the plasma chamber; a thermal energizer (20) to thermally energize the chemical prior to plasma deposition in the plasma chamber; at least one radio frequency (RF) electrode (30) provided within the plasma chamber to energize by RF the thermally-energized chemical to a plasma state; and a guide screen (40) provided within the plasma chamber between the at least one RF electrode and the substrate to increase turbulence of flow of the chemical in plasma state from the at least one RF electrode to the substrate for deposition on the substrate of the chemical in plasma state with increased turbulence of flow.
L'invention concerne un appareil de dépôt par plasma (100) comprenant : une chambre à plasma (10) pour le dépôt par plasma d'un produit chimique sur un substrat (200) dans la chambre à plasma ; un dispositif d'excitation thermique (20) pour exciter thermiquement le produit chimique avant le dépôt par plasma dans la chambre à plasma ; au moins une électrode radiofréquence (RF) (30) disposée à l'intérieur de la chambre à plasma pour exciter par RF le produit chimique à excitation thermique pour l'amener à l'état de plasma ; et un écran de guidage (40) disposé à l'intérieur de la chambre à plasma entre ladite ou lesdites électrodes RF et le substrat pour augmenter la turbulence de l'écoulement du produit chimique à l'état de plasma entre ladite ou lesdites électrodes RF et le substrat pour un dépôt sur le substrat du produit chimique à l'état de plasma avec une turbulence d'écoulement accrue.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>LAUNDERING</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TEXTILES</subject><subject>TREATMENT OF TEXTILES OR THE LIKE</subject><subject>TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAO8HEM9nVUcHEN8A_2DPH091NwDAhwDHIMCQ3mYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGhkZmBhaWjobGxKkCAOSdIZ0</recordid><startdate>20210624</startdate><enddate>20210624</enddate><creator>JAYASUNDARA, Herath Mudiyanselage Dilan Gaweshana</creator><creator>FERNANDO, Kurukulasooriya Merengiralalage Ranitha Prasanga</creator><creator>ARIYASINGHA, Muthunayaka Pathiranehelage Malindu</creator><creator>RATNAWEERA, Dilru Roshan</creator><creator>THENNAKOON, Thennakoon Mudiyanselage Manoj Pushpa Kumara</creator><creator>VITARANA, Ranil Keerthi</creator><creator>AMARASENA, Jayalath Pedige Samith Chandima</creator><creator>BOTHEJU, Welathanthrige Rajitha Sandaruwan</creator><scope>EVB</scope></search><sort><creationdate>20210624</creationdate><title>PLASMA DEPOSITION APPARATUS</title><author>JAYASUNDARA, Herath Mudiyanselage Dilan Gaweshana ; FERNANDO, Kurukulasooriya Merengiralalage Ranitha Prasanga ; ARIYASINGHA, Muthunayaka Pathiranehelage Malindu ; RATNAWEERA, Dilru Roshan ; THENNAKOON, Thennakoon Mudiyanselage Manoj Pushpa Kumara ; VITARANA, Ranil Keerthi ; AMARASENA, Jayalath Pedige Samith Chandima ; BOTHEJU, Welathanthrige Rajitha Sandaruwan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021126089A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>LAUNDERING</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TEXTILES</topic><topic>TREATMENT OF TEXTILES OR THE LIKE</topic><topic>TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>JAYASUNDARA, Herath Mudiyanselage Dilan Gaweshana</creatorcontrib><creatorcontrib>FERNANDO, Kurukulasooriya Merengiralalage Ranitha Prasanga</creatorcontrib><creatorcontrib>ARIYASINGHA, Muthunayaka Pathiranehelage Malindu</creatorcontrib><creatorcontrib>RATNAWEERA, Dilru Roshan</creatorcontrib><creatorcontrib>THENNAKOON, Thennakoon Mudiyanselage Manoj Pushpa Kumara</creatorcontrib><creatorcontrib>VITARANA, Ranil Keerthi</creatorcontrib><creatorcontrib>AMARASENA, Jayalath Pedige Samith Chandima</creatorcontrib><creatorcontrib>BOTHEJU, Welathanthrige Rajitha Sandaruwan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JAYASUNDARA, Herath Mudiyanselage Dilan Gaweshana</au><au>FERNANDO, Kurukulasooriya Merengiralalage Ranitha Prasanga</au><au>ARIYASINGHA, Muthunayaka Pathiranehelage Malindu</au><au>RATNAWEERA, Dilru Roshan</au><au>THENNAKOON, Thennakoon Mudiyanselage Manoj Pushpa Kumara</au><au>VITARANA, Ranil Keerthi</au><au>AMARASENA, Jayalath Pedige Samith Chandima</au><au>BOTHEJU, Welathanthrige Rajitha Sandaruwan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PLASMA DEPOSITION APPARATUS</title><date>2021-06-24</date><risdate>2021</risdate><abstract>A plasma deposition apparatus (100) comprising: a plasma chamber (10) for plasma deposition of a chemical on a substrate (200) in the plasma chamber; a thermal energizer (20) to thermally energize the chemical prior to plasma deposition in the plasma chamber; at least one radio frequency (RF) electrode (30) provided within the plasma chamber to energize by RF the thermally-energized chemical to a plasma state; and a guide screen (40) provided within the plasma chamber between the at least one RF electrode and the substrate to increase turbulence of flow of the chemical in plasma state from the at least one RF electrode to the substrate for deposition on the substrate of the chemical in plasma state with increased turbulence of flow.
L'invention concerne un appareil de dépôt par plasma (100) comprenant : une chambre à plasma (10) pour le dépôt par plasma d'un produit chimique sur un substrat (200) dans la chambre à plasma ; un dispositif d'excitation thermique (20) pour exciter thermiquement le produit chimique avant le dépôt par plasma dans la chambre à plasma ; au moins une électrode radiofréquence (RF) (30) disposée à l'intérieur de la chambre à plasma pour exciter par RF le produit chimique à excitation thermique pour l'amener à l'état de plasma ; et un écran de guidage (40) disposé à l'intérieur de la chambre à plasma entre ladite ou lesdites électrodes RF et le substrat pour augmenter la turbulence de l'écoulement du produit chimique à l'état de plasma entre ladite ou lesdites électrodes RF et le substrat pour un dépôt sur le substrat du produit chimique à l'état de plasma avec une turbulence d'écoulement accrue.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAUNDERING METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TEXTILES TREATMENT OF TEXTILES OR THE LIKE TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS |
| title | PLASMA DEPOSITION APPARATUS |
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