SLURRY COMPOSITION FOR POLISHING ORGANIC FILM
The present invention relates to a slurry composition for polishing an organic film, and the slurry composition for polishing an organic film according to one embodiment of the present invention comprises: abrasive particles; a polishing control agent containing an organic acid, an inorganic acid, o...
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| Format: | Patent |
| Sprache: | eng ; fre ; kor |
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| Zusammenfassung: | The present invention relates to a slurry composition for polishing an organic film, and the slurry composition for polishing an organic film according to one embodiment of the present invention comprises: abrasive particles; a polishing control agent containing an organic acid, an inorganic acid, or both; an organic film polishing enhancer containing an amide compound or an amide polymer; an oxidizing agent; and a pH control agent.
La présente invention concerne une composition de suspension épaisse pour le polissage d'un film organique, et la composition de suspension épaisse pour le polissage d'un film organique selon un mode de réalisation de la présente invention comprend : des particules abrasives ; un agent de contrôle de polissage contenant un acide organique, un acide inorganique, ou les deux ; un activateur de polissage de film organique contenant un composé amide ou un polymère amide ; un agent oxydant ; et un agent de régulation du pH.
본 발명은 유기막 연마용 슬러리 조성물에 관한 것으로, 본 발명의 일 실시예에 따른 유기막 연마용 슬러리 조성물은, 연마입자; 유기산, 무기산 또는 이 둘을 포함하는 연마조절제; 아마이드계 화합물 또는 아마이드계 고분자를 포함하는 유기막 연마향상제; 산화제; 및 pH 조절제;를 포함한다. |
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