FLEXIBLE COPPER CLAD LAMINATED FILM, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD OF MANUFACTURING FLEXIBLE COPPER CLAD LAMINATED FILM

Disclosed are a flexible copper clad laminated film, an electronic device including same, and a method of manufacturing the flexible copper clad laminated film. The flexible copper clad laminated film comprises: a non-conductive polymer substrate; a nickel-containing plating layer located on at leas...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, Jeong Deok, LEE, Yong Ho, JEONG, Woo Deuk
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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