FLEXIBLE COPPER CLAD LAMINATED FILM, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD OF MANUFACTURING FLEXIBLE COPPER CLAD LAMINATED FILM

Disclosed are a flexible copper clad laminated film, an electronic device including same, and a method of manufacturing the flexible copper clad laminated film. The flexible copper clad laminated film comprises: a non-conductive polymer substrate; a nickel-containing plating layer located on at least one surface of the substrate; and a copper plated layer positioned on the nickel-containing plated layer, wherein the copper plated layer may have an alteration rate of a full width at half maximum of 0.01° or less that has been calculated by Equation 1 below with respect to the peak of a (111) plane in an X-ray diffraction spectrum. An alteration rate of a full width at half maximum (111) = {(a full width at half maximum after 60 days) - (an initial full width at half maximum)} L'invention concerne un film stratifié plaqué de cuivre flexible, un dispositif électronique comportant ce dernier et un procédé de fabrication du film stratifié plaqué de cuivre flexible. Le film stratifié plaqué de cuivre flexible comprend : un substrat polymère non conducteur ; une couche de placage contenant du nickel située sur au moins une surface du substrat ; et une couche plaquée de cuivre positionnée sur la couche plaquée contenant du nickel, la couche plaquée de cuivre pouvant présenter un taux d'altération d'une largeur totale à la moitié du maximum de 0,01° ou moins qui a été calculé par l'équation 1 ci-dessous par rapport au pic d'un plan (111) dans un spectre de diffraction des rayons X. Un taux d'altération d'une largeur totale à la moitié du maximum (111) = {(une largeur totale à la moitié du maximum après 60 jours) - (une largeur totale initiale à la moitié du maximum)} 연성동박 적층필름, 이를 포함하는 전자 소자, 및 상기 연성동박 적층필름의 제작방법이 개시된다. 상기 연성동박 적층필름은 비전도성 고분자 기재; 상기 기재의 적어도 일 면에 위치한 니켈함유 도금층; 상기 니켈함유 도금층 상에 위치한 구리 도금층;을 포함하고, 상기 구리 도금층은 X-선 회절 스펙트럼에서 (111)면의 피크에 대한 하기 수학식 1에 의해 계산된 반치폭 변동률이 0.01°이하일 수 있다 반치폭(111) 변동률 = {(60일 간 방치한 후 반치폭) - (초기 반치폭)}