TAPE FOR ELECTRICAL CIRCUITS WITH ROSE-GOLD CONTACT PADS AND METHOD FOR MANUFACTURING SUCH A TAPE

A tape for manufacturing an electrical circuit with electrical contact pads, comprising: - a flexible dielectric substrate (4), - a copper foil (10) covering at least partially the dielectric substrate (4), the copper foil (10) having an internal face (18) facing the dielectric substrate (4), and an...

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Bibliographische Detailangaben
Hauptverfasser:	COQUILLARD, Stéphanie, VENON, Florian
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR CALCULATING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPUTING COUNTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HANDLING RECORD CARRIERS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PHYSICS PRESENTATION OF DATA PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS RECOGNITION OF DATA RECORD CARRIERS
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Beschreibung
Zusammenfassung:	A tape for manufacturing an electrical circuit with electrical contact pads, comprising: - a flexible dielectric substrate (4), - a copper foil (10) covering at least partially the dielectric substrate (4), the copper foil (10) having an internal face (18) facing the dielectric substrate (4), and an external face (19) opposite the internal face (18), - an intermediate layer comprising at least a nickel-based layer covering at least partially the external face (19) of the copper foil (10), A gold-copper alloy layer (13) is deposited on the intermediate layer. A method for manufacturing an electrical circuit, comprising providing a tape with conductive pads, and plating pads with a layer of gold-copper alloy electro-deposited from an electro-deposition solution. Bande à plots de contact électrique destiné à la fabrication d'un circuit électrique, comprenant : un substrat diélectrique flexible (4), une feuille de cuivre (10) recouvrant au moins partiellement le substrat diélectrique (4), la feuille de cuivre (10) ayant une face interne (18) faisant face au substrat diélectrique (4) et une face externe (19) opposée à la face interne (18), une couche intermédiaire comprenant au moins une couche à base de nickel recouvrant au moins partiellement la face externe (19) de la feuille de cuivre (10), une couche d'alliage or-cuivre (13) étant déposée sur la couche intermédiaire. Procédé de fabrication d'un circuit électrique, comprenant la fourniture d'une bande à plots conducteurs et le placage des plots d'une couche d'alliage or-cuivre électrodéposée à partir d'une solution d'électrodéposition.