SYSTEMS AND METHODS FOR FILM DEPOSITION

A system is described herein for film deposition includes a drum; a motor configured to rotate the drum in a direction of rotation; a target including a target material; and a holder attached to the drum. The holder is configured to accommodate a substrate and to expose the substrate to free particl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Chang-gyu, YUN, Jung-Hun, OH, Jeonghong
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A system is described herein for film deposition includes a drum; a motor configured to rotate the drum in a direction of rotation; a target including a target material; and a holder attached to the drum. The holder is configured to accommodate a substrate and to expose the substrate to free particles of the target material sputtered from the target, and the holder has an asymmetric shape. L'invention concerne un système de dépôt de film comprenant un tambour ; un moteur conçu pour faire tourner le tambour dans une direction de rotation ; une cible comprenant un matériau cible ; et un support fixé au tambour. Le support est conçu pour recevoir un substrat et pour exposer le substrat à des particules libres du matériau cible pulvérisé à partir de la cible, et le support a une forme asymétrique.