PCB HEAT DISSIPATION ASSEMBLY AND SERVER HAVING SAME

A PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) comprises: a PCB board (1), multiple chips (11) being provided on the PCB board (1); at least one heat dissipation device (2), the heat dissipation device (2) being disposed on the multiple chips...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PAN, Jianjun, LIAO, Shizhen, WANG, Xudong, ZHOU, Xuesong, ZHANG, Shuhao
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) comprises: a PCB board (1), multiple chips (11) being provided on the PCB board (1); at least one heat dissipation device (2), the heat dissipation device (2) being disposed on the multiple chips (11), and the heat dissipation device (2) comprising a heat dissipation air channel (21); an air baffle (3), the air baffle (3) being disposed adjacent to the at least one heat dissipation device (2), the air baffle (3) being located on one side of the at least one heat dissipation device (2), and the air baffle (3) extending along the heat dissipation air channel (21). La présente invention concerne un ensemble de dissipation thermique (100) et un serveur qui a celui-ci. L'ensemble de dissipation thermique de PCB (100) comprend : une carte PCB (1), de multiples puces (11) étant prévues sur la carte PCB (1) ; au moins un dispositif de dissipation thermique (2), le dispositif de dissipation thermique (2) étant dispo