CELL FOR MEASURING CONCENTRATION OF ADDITIVE BREAKDOWN PRODUCTION IN PLATING SOLUTION

Provided are a measurement method, an electrochemical measuring cell, and a measuring device which are capable of directly and continuously measuring the concentration of monovalent copper ions (Cu+), 3-mercaptopropyl sulfonate (MPS), or Cu+-MPS, which is a plating additive breakdown product, in a p...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LEE, Joo-yul, CHOE, Seung-hoe, LEE, Kyu-hwan, KIM, Man, HAN, Myeongjin, KWAN, Younghwon, YOO, Bung-uk
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are a measurement method, an electrochemical measuring cell, and a measuring device which are capable of directly and continuously measuring the concentration of monovalent copper ions (Cu+), 3-mercaptopropyl sulfonate (MPS), or Cu+-MPS, which is a plating additive breakdown product, in a plating solution during a copper plating process. Sont divulgués un procédé de mesure, une cellule de mesure électrochimique et un dispositif de mesure qui sont capables de mesurer directement et en continu la concentration d'ions de cuivre monovalents (Cu+), 3-mercaptopropyl sulfonate (MPS), ou Cu+-MPS, qui est un produit de rupture additive de placage, dans une solution de placage pendant un procédé de placage de cuivre.