THERMAL CONDUCTOR, THERMALLY CONDUCTIVE MATERIAL, AND PACKAGING STRUCTURE OF SEMICONDUCTOR DEVICE

A thermal conductor (20) having high thermal conductivity, which can be used for heat dissipation for a semiconductor device (10), and can be used in particular in the field of semiconductor device (10) packaging. The thermal conductor (20) comprises a matrix (28) and diamond particles (21) and first metal nanoparticles (25) which are distributed within the matrix (28), and the outer surfaces of the diamond particles (21) sequentially comprise a carbide film layer (22), a first metal film layer (23) and a second metal film layer (24), said three film layers being used to reduce interfacial thermal resistance between the diamond particles (21) and the first metal nanoparticles (25). In addition, also provided are a dynamic-flow thermally conductive material and a semiconductor packaging structure which uses a thermal conductor (20). La présente invention concerne un conducteur thermique (20) ayant une conductivité thermique élevée, qui peut être utilisé pour la dissipation de chaleur pour un dispositif à semi-