THERMAL CONDUCTIVITY IMPROVER, THERMAL CONDUCTIVITY IMPROVEMENT METHOD, THERMAL-CONDUCTIVE RESIN COMPOSITION AND THERMAL-CONDUCTIVE RESIN MOLDED PRODUCT

Provided is a resin composition having excellent thermal conductivity.　This thermal-conductive resin composition comprises a resin, a first thermal-conductive filler having an aspect ratio of 10 or higher and a longer diameter of less than 30 µm, and a second thermal-conductive filler having an aspe...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI, Katsuhiro, IWAMOTO, Yoshihito
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a resin composition having excellent thermal conductivity.　This thermal-conductive resin composition comprises a resin, a first thermal-conductive filler having an aspect ratio of 10 or higher and a longer diameter of less than 30 µm, and a second thermal-conductive filler having an aspect ratio of 2 or smaller. L'invention concerne une composition de résine ayant une excellente conductivité thermique.　Cette composition de résine thermoconductrice comprend une résine, une première charge thermoconductrice ayant un rapport d'aspect de 10 ou plus et un diamètre plus long inférieur à 30 µm, et une seconde charge thermoconductrice ayant un rapport d'aspect de 2 ou moins. 優れた熱伝導性を有する樹脂組成物を提供する。　熱伝導性樹脂組成物であって、樹脂と、アスペクト比が１０以上で、長径が３０μｍ未満の第１熱伝導性フィラーと、アスペクト比が２以下の第２熱伝導性フィラーとを含む。