ELECTRONIC COMPONENT MOUNTING STRUCTURE

Provided is an electronic component mounting structure in which an electronic component group is mounted atop a substrate. The substrate includes: an inflow port and an outflow port for current; and a pattern that constitutes a section of a current flow path between the inflow port and the outflow p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAGITA Kazuhiro, ISHIKAWA Yoshiaki, MORITSUGU Masaharu
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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