CONTACTLESS COMMUNICATION MEDIUM AND MANUFACTURING METHOD FOR CONTACTLESS COMMUNICATION MEDIUM

A contactless communication medium according to an aspect of the present technology is provided with an IC module, a first member, a second member, and a printing layer. The IC module is capable of perform contactless communication. The first member includes a first surface in which a recessed part...

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description A contactless communication medium according to an aspect of the present technology is provided with an IC module, a first member, a second member, and a printing layer. The IC module is capable of perform contactless communication. The first member includes a first surface in which a recessed part in which the IC module is accommodated is formed and a second surface opposite to the first surface, and is formed of a first transparent resin material. The second member is connected to the first surface or the second surface, and is formed of a second transparent resin material. The printing layer is disposed between the first member and the second member. L'invention concerne un support de communication sans contact, selon un aspect de la présente technologie, étant pourvu d'un module de circuit intégré (CI), d'un premier élément, d'un second élément et d'une couche d'impression. Le module de CI est capable d'effectuer une communication sans contact. Le premier élément comprend une première surface dans laquelle une partie évidée dans laquelle est logé le module de CI est formée et une seconde surface opposée à la première surface, et est formé d'un premier matériau de résine transparent. Le second élément est relié à la première surface ou à la seconde surface, et est formé d'un second matériau de résine transparent. La couche d'impression est disposée entre le premier élément et le second élément. 本技術の一形態に係る非接触通信媒体は、ICモジュールと、第1の部材と、第2の部材と、印刷層とを具備する。前記ICモジュールは、非接触通信が可能である。前記第1の部材は、前記ICモジュールが収容される凹部が形成された第1の面と、前記第1の面の反対側の第2の面とを有し、第1の透明樹脂材料からなる。前記第2の部材は、前記第1の面又は前記第2の面に接続され、第2の透明樹脂材料からなる。前記印刷層は、前記第1の部材と前記第2の部材との間に配置される。
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The IC module is capable of perform contactless communication. The first member includes a first surface in which a recessed part in which the IC module is accommodated is formed and a second surface opposite to the first surface, and is formed of a first transparent resin material. The second member is connected to the first surface or the second surface, and is formed of a second transparent resin material. The printing layer is disposed between the first member and the second member. L'invention concerne un support de communication sans contact, selon un aspect de la présente technologie, étant pourvu d'un module de circuit intégré (CI), d'un premier élément, d'un second élément et d'une couche d'impression. Le module de CI est capable d'effectuer une communication sans contact. Le premier élément comprend une première surface dans laquelle une partie évidée dans laquelle est logé le module de CI est formée et une seconde surface opposée à la première surface, et est formé d'un premier matériau de résine transparent. Le second élément est relié à la première surface ou à la seconde surface, et est formé d'un second matériau de résine transparent. La couche d'impression est disposée entre le premier élément et le second élément. 本技術の一形態に係る非接触通信媒体は、ICモジュールと、第1の部材と、第2の部材と、印刷層とを具備する。前記ICモジュールは、非接触通信が可能である。前記第1の部材は、前記ICモジュールが収容される凹部が形成された第1の面と、前記第1の面の反対側の第2の面とを有し、第1の透明樹脂材料からなる。前記第2の部材は、前記第1の面又は前記第2の面に接続され、第2の透明樹脂材料からなる。前記印刷層は、前記第1の部材と前記第2の部材との間に配置される。</description><language>eng ; fre ; jpn</language><subject>ADVERTISING ; BOOK COVERS ; BOOKBINDING ; CALCULATING ; COFFEE MILLS ; COMPUTING ; COUNTING ; CRYPTOGRAPHY ; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ; DISPLAY ; DISPLAYING ; DOMESTIC ARTICLES OR APPLIANCES ; EDUCATION ; FILES ; FURNITURE ; HANDLING RECORD CARRIERS ; HOUSEHOLD OR TABLE EQUIPMENT ; HUMAN NECESSITIES ; LABELS OR NAME-PLATES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LOOSE LEAVES ; MOVABLE-STRIP WRITING OR READING APPARATUS ; PERFORMING OPERATIONS ; PHYSICS ; PRESENTATION OF DATA ; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES ; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEALS ; SIGNS ; SPECIAL PRINTED MATTER ; SPICE MILLS ; SUCTION CLEANERS IN GENERAL ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210311&amp;DB=EPODOC&amp;CC=WO&amp;NR=2021044748A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210311&amp;DB=EPODOC&amp;CC=WO&amp;NR=2021044748A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKANO, Aki</creatorcontrib><title>CONTACTLESS COMMUNICATION MEDIUM AND MANUFACTURING METHOD FOR CONTACTLESS COMMUNICATION MEDIUM</title><description>A contactless communication medium according to an aspect of the present technology is provided with an IC module, a first member, a second member, and a printing layer. The IC module is capable of perform contactless communication. The first member includes a first surface in which a recessed part in which the IC module is accommodated is formed and a second surface opposite to the first surface, and is formed of a first transparent resin material. The second member is connected to the first surface or the second surface, and is formed of a second transparent resin material. The printing layer is disposed between the first member and the second member. L'invention concerne un support de communication sans contact, selon un aspect de la présente technologie, étant pourvu d'un module de circuit intégré (CI), d'un premier élément, d'un second élément et d'une couche d'impression. Le module de CI est capable d'effectuer une communication sans contact. 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La couche d'impression est disposée entre le premier élément et le second élément. 本技術の一形態に係る非接触通信媒体は、ICモジュールと、第1の部材と、第2の部材と、印刷層とを具備する。前記ICモジュールは、非接触通信が可能である。前記第1の部材は、前記ICモジュールが収容される凹部が形成された第1の面と、前記第1の面の反対側の第2の面とを有し、第1の透明樹脂材料からなる。前記第2の部材は、前記第1の面又は前記第2の面に接続され、第2の透明樹脂材料からなる。前記印刷層は、前記第1の部材と前記第2の部材との間に配置される。</description><subject>ADVERTISING</subject><subject>BOOK COVERS</subject><subject>BOOKBINDING</subject><subject>CALCULATING</subject><subject>COFFEE MILLS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>CRYPTOGRAPHY</subject><subject>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>DOMESTIC ARTICLES OR APPLIANCES</subject><subject>EDUCATION</subject><subject>FILES</subject><subject>FURNITURE</subject><subject>HANDLING RECORD CARRIERS</subject><subject>HOUSEHOLD OR TABLE EQUIPMENT</subject><subject>HUMAN NECESSITIES</subject><subject>LABELS OR NAME-PLATES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LOOSE LEAVES</subject><subject>MOVABLE-STRIP WRITING OR READING APPARATUS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</subject><subject>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEALS</subject><subject>SIGNS</subject><subject>SPECIAL PRINTED MATTER</subject><subject>SPICE MILLS</subject><subject>SUCTION CLEANERS IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhz9vcLcXQO8XENDlZw9vf1DfXzdHYM8fT3U_B1dfEM9VVw9HNR8HX0C3UDqgoN8vRzB0qEePi7KLj5BykQ0s3DwJqWmFOcyguluRmU3VxDnD10Uwvy41OLCxKTU_NSS-LD_Y0MjAwNTEzMTSwcDY2JUwUAM0A0WA</recordid><startdate>20210311</startdate><enddate>20210311</enddate><creator>NAKANO, Aki</creator><scope>EVB</scope></search><sort><creationdate>20210311</creationdate><title>CONTACTLESS COMMUNICATION MEDIUM AND MANUFACTURING METHOD FOR CONTACTLESS COMMUNICATION MEDIUM</title><author>NAKANO, Aki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021044748A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2021</creationdate><topic>ADVERTISING</topic><topic>BOOK COVERS</topic><topic>BOOKBINDING</topic><topic>CALCULATING</topic><topic>COFFEE MILLS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>CRYPTOGRAPHY</topic><topic>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>DOMESTIC ARTICLES OR APPLIANCES</topic><topic>EDUCATION</topic><topic>FILES</topic><topic>FURNITURE</topic><topic>HANDLING RECORD CARRIERS</topic><topic>HOUSEHOLD OR TABLE EQUIPMENT</topic><topic>HUMAN NECESSITIES</topic><topic>LABELS OR NAME-PLATES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LOOSE LEAVES</topic><topic>MOVABLE-STRIP WRITING OR READING APPARATUS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</topic><topic>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEALS</topic><topic>SIGNS</topic><topic>SPECIAL PRINTED MATTER</topic><topic>SPICE MILLS</topic><topic>SUCTION CLEANERS IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKANO, Aki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKANO, Aki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONTACTLESS COMMUNICATION MEDIUM AND MANUFACTURING METHOD FOR CONTACTLESS COMMUNICATION MEDIUM</title><date>2021-03-11</date><risdate>2021</risdate><abstract>A contactless communication medium according to an aspect of the present technology is provided with an IC module, a first member, a second member, and a printing layer. The IC module is capable of perform contactless communication. The first member includes a first surface in which a recessed part in which the IC module is accommodated is formed and a second surface opposite to the first surface, and is formed of a first transparent resin material. The second member is connected to the first surface or the second surface, and is formed of a second transparent resin material. The printing layer is disposed between the first member and the second member. L'invention concerne un support de communication sans contact, selon un aspect de la présente technologie, étant pourvu d'un module de circuit intégré (CI), d'un premier élément, d'un second élément et d'une couche d'impression. Le module de CI est capable d'effectuer une communication sans contact. Le premier élément comprend une première surface dans laquelle une partie évidée dans laquelle est logé le module de CI est formée et une seconde surface opposée à la première surface, et est formé d'un premier matériau de résine transparent. Le second élément est relié à la première surface ou à la seconde surface, et est formé d'un second matériau de résine transparent. La couche d'impression est disposée entre le premier élément et le second élément. 本技術の一形態に係る非接触通信媒体は、ICモジュールと、第1の部材と、第2の部材と、印刷層とを具備する。前記ICモジュールは、非接触通信が可能である。前記第1の部材は、前記ICモジュールが収容される凹部が形成された第1の面と、前記第1の面の反対側の第2の面とを有し、第1の透明樹脂材料からなる。前記第2の部材は、前記第1の面又は前記第2の面に接続され、第2の透明樹脂材料からなる。前記印刷層は、前記第1の部材と前記第2の部材との間に配置される。</abstract><oa>free_for_read</oa></addata></record>
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language eng ; fre ; jpn
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subjects ADVERTISING
BOOK COVERS
BOOKBINDING
CALCULATING
COFFEE MILLS
COMPUTING
COUNTING
CRYPTOGRAPHY
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
DISPLAY
DISPLAYING
DOMESTIC ARTICLES OR APPLIANCES
EDUCATION
FILES
FURNITURE
HANDLING RECORD CARRIERS
HOUSEHOLD OR TABLE EQUIPMENT
HUMAN NECESSITIES
LABELS OR NAME-PLATES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
LOOSE LEAVES
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SEALS
SIGNS
SPECIAL PRINTED MATTER
SPICE MILLS
SUCTION CLEANERS IN GENERAL
TRANSPORTING
title CONTACTLESS COMMUNICATION MEDIUM AND MANUFACTURING METHOD FOR CONTACTLESS COMMUNICATION MEDIUM
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