THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE

A thermosetting resin composition for light reflection according to the present disclosure comprises an epoxy resin, a curing agent, an inorganic filler, a white pigment, and a mold-releasing agent, wherein the mold-releasing agent includes a zinc-based metal soap and an aluminum-based metal soap. U...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO Takashi, INABA Yoshihito, SUTOU Hikaru, NARA Naoki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A thermosetting resin composition for light reflection according to the present disclosure comprises an epoxy resin, a curing agent, an inorganic filler, a white pigment, and a mold-releasing agent, wherein the mold-releasing agent includes a zinc-based metal soap and an aluminum-based metal soap. Une composition de résine thermodurcissable pour la réflexion de la lumière selon la présente invention comprend une résine époxy, un agent de durcissement, une charge inorganique, un pigment blanc et un agent de démoulage, l'agent de démoulage comprenant un savon métallique à base de zinc et un savon métallique à base d'aluminium. 本開示に係る光反射用熱硬化性樹脂組成物は、エポキシ樹脂、硬化剤、無機充填剤、白色顔料及び離型剤を含有し、離型剤が、亜鉛系金属石鹸とアルミニウム系金属石鹸とを含む。