SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

The present invention comprises: a semiconductor chip (30); a heat dissipation member (20) on which the semiconductor chip (30) is mounted; and a sealing member (60) for sealing the semiconductor chip (30). The sealing member (60) is made of a liquid crystal polymer. La présente invention comprend :...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAMIKOMAKI Ryuma, MASUDA Gentarou, MIYANO Hirotaka, YOKOCHI Tomohiro, YAMAGUCHI Akihiro, IMAIZUMI Norihisa, KONDOH Kouji
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention comprises: a semiconductor chip (30); a heat dissipation member (20) on which the semiconductor chip (30) is mounted; and a sealing member (60) for sealing the semiconductor chip (30). The sealing member (60) is made of a liquid crystal polymer. La présente invention comprend : une puce semi-conductrice (30) ; un élément de dissipation thermique (20) sur lequel est montée la puce semi-conductrice (30) ; et un élément d'étanchéité (60) pour sceller la puce semi-conductrice (30). L'élément d'étanchéité (60) est constitué d'un polymère à cristaux liquides. 半導体チップ（３０）と、半導体チップ（３０）を搭載する放熱部材（２０）と、半導体チップ（３０）を封止する封止部材（６０）と、を備える。そして、封止部材（６０）は、液晶ポリマで構成されるようにする。