PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group. L'inventio...

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Bibliographische Detailangaben
Hauptverfasser:	KURODA Ayaka, SUNOHARA Seiji
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group. L'invention concerne une composition de résine photosensible qui comprend un polymère de liant, un composé photopolymérisable et un initiateur de photopolymérisation. Le polymère de liant contient une unité structurale dérivée d'un composé (méth)acrylate possédant un groupe dicyclopentanyle. 本発明は、バインダーポリマーと、光重合性化合物と、光重合開始剤と、を含有する感光性樹脂組成物であって、バインターポリマーが、ジシクロペンタニル基を有する（メタ）アクリレート化合物に由来する構造単位を含む、感光性樹脂組成物に関する。