CHEMICAL-MECHANICAL POLISHING PARTICLE AND POLISHING SLURRY COMPOSITION COMPRISING SAME

The present invention provides a chemical-mechanical polishing particle having high polishing quality with a high polishing rate and few defects or scratches by modifying the surface of a polishing particle, and a polishing slurry composition comprising same. La présente invention concerne une parti...

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Bibliographische Detailangaben
Hauptverfasser:	CHO, Gyeong Sook, KIM, Jae Hyun, JIN, Sung Hoon, YOO, Jae Hong, SHIN, Kyu Soon, LEE, Goo Hwa, MOON, Weoun Gyuen, LEE, Min Gun, PARK, Jong Dai
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES
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Beschreibung
Zusammenfassung:	The present invention provides a chemical-mechanical polishing particle having high polishing quality with a high polishing rate and few defects or scratches by modifying the surface of a polishing particle, and a polishing slurry composition comprising same. La présente invention concerne une particule de polissage chimico-mécanique ayant une qualité de polissage élevée avec un taux de polissage élevé et peu de défauts ou de rayures par modification de la surface d'une particule de polissage, et une composition de suspension de polissage la comprenant. 본 발명은 연마 입자의 표면을 개질하여, 높은 연마 속도, 결점이나 스크래치가 작은 양질의 연마 품질을 갖는 화학-기계적 연마 입자 및 이를 포함하는 연마 슬러리 조성물을 제공한다.