HIGH TEMPERATURE, CONDUCTIVE THERMOSETTING RESIN COMPOSITIONS

The present invention provides high temperature performing, conductive thermosetting resin compositions. La présente invention concerne des compositions de résine thermodurcissable conductrice à haute température.

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Bibliographische Detailangaben
1. Verfasser:	KONG, Stanley Shengqian
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides high temperature performing, conductive thermosetting resin compositions. La présente invention concerne des compositions de résine thermodurcissable conductrice à haute température.