CONNECTING STRUCTURE OF FLEXIBLE SUBSTRATE THIN FILM BULK ACOUSTIC WAVE FILTER

A connecting structure of a flexible substrate thin film bulk acoustic wave filter, comprising: a first top electrode and a second top electrode, wherein a gap is formed between said top electrodes; piezoelectric layers (511, 611, 720, 811, 911, 1011) below the first top electrode and the second top...

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Bibliographische Detailangaben
Hauptverfasser:	PANG, Wei, GAO, Chuanhai, ZHANG, Menglun
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
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Beschreibung
Zusammenfassung:	A connecting structure of a flexible substrate thin film bulk acoustic wave filter, comprising: a first top electrode and a second top electrode, wherein a gap is formed between said top electrodes; piezoelectric layers (511, 611, 720, 811, 911, 1011) below the first top electrode and the second top electrode; one or two bottom electrodes (512, 612, 730, 812, 912, 1012) below the piezoelectric layers (511, 611, 720, 811, 911, 1011); and a flexible substrate (520, 620, 750, 820, 920, 1020) below the bottom electrode (512, 612, 730, 812, 912, 1012); wherein the piezoelectric layers (511, 611, 720, 811, 911, 1011) is not arranged below the gap between the two top electrodes (510, 610, 710, 810, 910, 1010). L'invention concerne une structure de connexion d'un filtre à ondes acoustiques de volume à couches minces et à substrat souple comprenant : une première électrode supérieure et une seconde électrode supérieure, un espace étant formé entre lesdites électrodes supérieures; des couches piézoélectriques (511, 611