DIAGNOSTIC DETECTION CHIP DEVICES AND METHODS OF MANUFACTURE AND ASSEMBLY

Diagnostic detection chip device designs that reduce cost of fabrication and assembly are described herein. Such chip device designs include features that facilitate use of the chip within a chip carrier device with integrated fluid flow control features and compatibility with conventional sample ca...

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Bibliographische Detailangaben
1. Verfasser:	DORITY, Douglas B
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BEER BIOCHEMISTRY CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE CHEMISTRY COMPOSITIONS OR TEST PAPERS THEREFOR CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL ORENZYMOLOGICAL PROCESSES ENZYMOLOGY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEICACIDS OR MICROORGANISMS METALLURGY MICROBIOLOGY MUTATION OR GENETIC ENGINEERING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS PROCESSES OF PREPARING SUCH COMPOSITIONS SPIRITS TESTING TRANSPORTING VINEGAR WINE
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Beschreibung
Zusammenfassung:	Diagnostic detection chip device designs that reduce cost of fabrication and assembly are described herein. Such chip device designs include features that facilitate use of the chip within a chip carrier device with integrated fluid flow control features and compatibility with conventional sample cartridges and sample processing systems. Associated methods of manufacture and assembly of the chip devices are also provided herein. L'invention concerne des conceptions de dispositif à puce de détection de diagnostic qui réduisent le coût de fabrication et d'assemblage. De telles conceptions de dispositif à puce comprennent des caractéristiques qui facilitent l'utilisation de la puce dans un dispositif de support à puce ayant des caractéristiques de commande d'écoulement de fluide intégrées et une compatibilité avec des cartouches d'échantillon classiques et des systèmes de traitement d'échantillon. L'invention concerne également des procédés de fabrication et d'assemblage associés des dispositifs à puce.