WAFER DE-CHUCKING DETECTION AND ARCING PREVENTION

Methods and systems of detection of wafer de-chucking in a semiconductor processing chamber are disclosed. Methods and systems of interdiction are also disclosed to prevent hardware and wafer damage during semiconductor fabrication if and when de-chucking is detected. In one embodiment, a de-chuckin...

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Bibliographische Detailangaben
Hauptverfasser: MUNGEKAR, Hemant, YOON, Byung Chul, BALASUBRAMANIAN, Ganesh
Format: Patent
Sprache:eng ; fre
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