SILICA SPHERICAL PARTICLES FOR SEMICONDUCTOR SEALING MATERIAL

The purpose of the present invention is to provide: silica particles of which the maximum particle diameter can be minimized and which can achieve proper fluidability that cannot be achieved by the conventional techniques; and silica spherical particles which, when used as a filler for a heat-dissip...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AE, Masanori, SAITO, Dota, YAGI, Katsumasa, TANAKA, Mutsuhito, DEAI, Hiroyuki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CHEMISTRY COMPOUNDS THEREOF INORGANIC CHEMISTRY METALLURGY NON-METALLIC ELEMENTS
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