BONDING DEVICE, DIE BONDER AND BONDING METHOD

A bonding device which bonds a workpiece to a supplied member via an adhesive and is equipped with a heating means for heating the supplied member in a bonding location where the workpiece is bonded to the supplied member, the bonding device being equipped with a control means in which the supplied...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NAGAMOTO Nobuhiro
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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