PRINTED CIRCUIT BOARD SUBSTRATE COMPRISING A COATED BORON NITRIDE

In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, Eui Kyoon, FITTS, Bruce, BROWN, Christopher
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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