THIOL-CONTAINING COMPOSITION

The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods. La présente invention concerne une composition com...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAN, Kar Tean, VOTRUBA-DRZAL, Peter L, ZHOU, Hongying, NAKAJIMA, Masayuki, RAYER, Baptiste, FRENCH, Maria S, CONDIE, Allison G
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods. La présente invention concerne une composition comprenant : un composé époxy, un agent de durcissement polythiol et un second agent de durcissement. L'invention concerne également des procédés de traitement d'un substrat avec la composition et des substrats formés par lesdits procédés.