ADHESIVE WITH TUNABLE ADHESION FOR HANDLING ULTRA-THIN WAFER
Described is an apparatus which comprises a wafer tray having an adhesive layer, with dynamically adjustable adhesion properties, deposited on a surface of the wafer tray; a wafer positioned on the wafer tray; and a cooling agent which is operable to cool at least a portion of the adhesive layer bel...
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| Format: | Patent |
| Sprache: | eng ; fre |
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