METHOD AND DEVICE FOR CONTROLLING POSITIONING OF PATCH

A patch positioning control method for dyeing a specimen by using a patch, according to the present invention, comprises the steps of: positioning the patch in a first position which is an oblique position; allowing and approaches of the patch to a substrate surface on which the specimen is position...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE, Dong Young, CHO, Jae Ryun, SONG, Young Hoon
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A patch positioning control method for dyeing a specimen by using a patch, according to the present invention, comprises the steps of: positioning the patch in a first position which is an oblique position; allowing and approaches of the patch to a substrate surface on which the specimen is positioned while maintaining the patch in the first position; and allowing the patch to make contact with the specimen placed on the substrate surface such that the dye sample is transferred to the specimen. L'invention concerne un procédé de commande de positionnement de patch pour colorer un spécimen à l'aide d'un patch, comprenant les étapes consistant : à positionner le patch dans une première position qui est une position oblique ; à permettre les approches et du patch à une surface de substrat sur laquelle le spécimen est positionné tout en maintenant le patch dans la première position ; et à laisser le patch entrer en contact avec l'échantillon placé sur la surface du substrat de telle sorte que l'échantillon de colorant soit transféré à l'échantillon. 본 발명은 패치를 이용하여 검체를 염색하기 위한 패치 자세 제어 방법에 있어서, 상기 패치를 비스듬한 자세인 제1 자세로 위치시키는 단계, 상기 패치를 제1 자세로 유지하면서 상기 검체가 위치된 기판면을 향해접근시키는 단계 및 상기 검체에 상기 염색 시료가 전달되도록 상기 기판면에 놓인 상기 검체에 상기 패치를 접촉시키는 단계를 포함한다.