COPPER ELECTROFILL ON NON-COPPER LINER LAYERS

Void-free bottom-up fill of copper in features is achieved on non-copper liner layers. A non-copper liner layer has a higher resistivity than copper. An electroplating solution for plating copper on a non-copper liner layer includes a low copper concentration, high pH, organic additives, and bromide...

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Bibliographische Detailangaben

Hauptverfasser:	BROGAN, Lee J, REID, Jonathan David, LIU, Yi Hua
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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