SEMICONDUCTOR DEVICE

This semiconductor device (50) is provided with: a lead frame (1) having a lead (23) and a die pad (24); a printed board (3) provided with electrodes (25, 26) which connect the lead (23) and the die pad (24), respectively, a wiring pattern (11), and an opening (22) which exposes a portion of the sur...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MIYAWAKI Katsumi
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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