SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The present invention simplifies the formation of an isolation region of a semiconductor substrate having an increased film thickness. This semiconductor device is provided with: an element region, a wiring region, an external connection unit, a front surface side isolation region, and a rear surfac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUDOU Tomoaki, KAWABATA Kazuya, CHIBA Yohei
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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