POLYAMIDE-IMIDE RESIN FILM

The present invention relates to a polyamide-imide resin film comprising a polyamide-imide block copolymer with a particular structure and having a predetermined retardation. La présente invention concerne un film de résine polyamide-imide comprenant un copolymère séquencé polyamide-imide ayant une...

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Bibliographische Detailangaben
Hauptverfasser:	YU, Yunah, KIM, Byungguk, JANG, Duk Hun, KIM, Sanggon, EOM, Youngsik, CHOI, Hyungsam, CHOI, Sungyeol
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a polyamide-imide resin film comprising a polyamide-imide block copolymer with a particular structure and having a predetermined retardation. La présente invention concerne un film de résine polyamide-imide comprenant un copolymère séquencé polyamide-imide ayant une structure particulière et ayant un retard prédéterminé. 본 발명은, 특정한 구조를 폴리아미드이미드 블록 공중합체를 포함하고 소정의 티라데이션을 갖는 폴리아미드이미드 수지 필름에 관한 것이다.