THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD

The present invention provides a thermosetting resin composition, a prepreg, a laminate, and a printed circuit board. The thermosetting resin composition comprises: a thermosetting resin, an inorganic filler, and a porous molybdenum compound. By using the porous molybdenum compound as a solid lubricant, the problems of dispersion and sedimentation of a molybdenum compound can be effectively solved, so that the molybdenum compound can be evenly distributed in a prepreg; the porous molybdenum compound has better thermal conductivity, and can better conduct heat during drilling, and the melted resin can be prevented from adhering to a drilling tool; in addition, hole cracks can also be reduced, and the quality of the wall of a drilled hole can be obviously improved. La présente invention concerne une composition de résine thermodurcissable, un préimprégné, un stratifié et une carte de circuit imprimé. La composition de résine thermodurcissable comprend : une résine thermodurcissable, une charge inorganique et un