LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE SURFACE
A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces. L'invent...
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| creator | YAGODA, Jared BEUHLER, Allyson |
| description | A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.
L'invention concerne une carte à circuit imprimé. La carte à circuit imprimé comprend : une couche de substrat; une couche de cuivre disposée sur la couche de substrat ; et une couche de conservation de soudabilité organique (OSP) disposée sur la couche de cuivre. La couche OSP définit au moins une surface OSP traitée au laser. |
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L'invention concerne une carte à circuit imprimé. La carte à circuit imprimé comprend : une couche de substrat; une couche de cuivre disposée sur la couche de substrat ; et une couche de conservation de soudabilité organique (OSP) disposée sur la couche de cuivre. La couche OSP définit au moins une surface OSP traitée au laser.</description><language>eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190627&DB=EPODOC&CC=WO&NR=2019126277A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190627&DB=EPODOC&CC=WO&NR=2019126277A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAGODA, Jared</creatorcontrib><creatorcontrib>BEUHLER, Allyson</creatorcontrib><title>LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE SURFACE</title><description>A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.
L'invention concerne une carte à circuit imprimé. La carte à circuit imprimé comprend : une couche de substrat; une couche de cuivre disposée sur la couche de substrat ; et une couche de conservation de soudabilité organique (OSP) disposée sur la couche de cuivre. La couche OSP définit au moins une surface OSP traitée au laser.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD1cQx2DVJwdPJxDPH091Nw8w9SCPcMclVw8vdz8fRzVwCK-Qe5O_p5OisE-_u4uAY5Onn6eIZEKgQEuQJ1hgG1hbkqBIcGuTk6u_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDQ0tDIzMjc3NHQ2PiVAEApsYvTg</recordid><startdate>20190627</startdate><enddate>20190627</enddate><creator>YAGODA, Jared</creator><creator>BEUHLER, Allyson</creator><scope>EVB</scope></search><sort><creationdate>20190627</creationdate><title>LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE SURFACE</title><author>YAGODA, Jared ; BEUHLER, Allyson</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2019126277A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAGODA, Jared</creatorcontrib><creatorcontrib>BEUHLER, Allyson</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAGODA, Jared</au><au>BEUHLER, Allyson</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE SURFACE</title><date>2019-06-27</date><risdate>2019</risdate><abstract>A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.
L'invention concerne une carte à circuit imprimé. La carte à circuit imprimé comprend : une couche de substrat; une couche de cuivre disposée sur la couche de substrat ; et une couche de conservation de soudabilité organique (OSP) disposée sur la couche de cuivre. La couche OSP définit au moins une surface OSP traitée au laser.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE SURFACE |
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