TIN-INDIUM ALLOY ELECTROPLATING SOLUTION

The disclosure provides a Sn-In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn-In alloy film on a Cu substrat...

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Bibliographische Detailangaben
Hauptverfasser:	SOULE, Luke, MAJUMDAR, Bhaskar S, BHASSYVASANTHA, Sherin
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The disclosure provides a Sn-In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn-In alloy film on a Cu substrate effectively mitigates whisker growth. L'invention concerne un bain d'électroplacage de Sn-In, exempt de Pb et inoffensif pour l'environnement, fonctionnant à température ambiante et ne nécessitant pas de modification des ensembles de placage existants. Le vieillissement à température ambiante et les essais de cyclage thermique limité montrent que le film en alliage Sn-In électroplaqué sur un substrat de Cu atténue efficacement la croissance de barbe.