SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD AND COMPUTER STORAGE MEDIUM

This substrate processing system for processing a substrate comprises: a first peripheral edge removal unit which is provided with a first grinding stone that comes into contact with the peripheral edge portion of the substrate, and which grinds and removes the peripheral edge portion to a first dep...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IKEUE, Kazuya, OKAWA, Satoshi, SAKAUE, Takashi
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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