SPECTROMETRY IN INTEGRATED CIRCUIT USING A PHOTONIC BANDGAP STRUCTURE

An encapsulated package (100) includes an integrated circuit (IC) die (102). An encapsulation material (110) encapsulates the IC die (102). A set of broadband spectral sensors (111, 112, 113) on the IC die (102) are configured to generate a set of signals in response to electromagnetic energy (140)...

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Bibliographische Detailangaben

Hauptverfasser:	REVIER, Daniel, COOK, Benjamin
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
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