SURFACE MOUNTED STRUCTURE, SURFACE MOUNTING METHOD, MOTOR, AND SURFACE MOUNTED CHIP

The present invention discloses a surface mounted structure, a surface mounting method, a motor, and a surface mounted chip capable of reducing a thickness of a printed circuit board, thereby reducing production costs of the printed circuit board, simplifying a manufacturing process of the printed circuit board, and extending service life of the printed circuit board. The surface mounted structure comprises: a printed circuit board having a void, a first surface of the printed circuit board being provided with a circuit layer; a sensor chip comprising a chip main body having a sensor element packaged therein and a lead led out from the chip main body, the chip main body being located in the void, the sensor element facing a second surface of the printed circuit board, and the lead being connected to the circuit layer. La présente invention concerne une structure montée en surface, un procédé de montage en surface, un moteur et une puce montée en surface permettant de réduire l'épaisseur d'une carte de circuit