ACOUSTIC MANAGEMENT IN INTEGRATED CIRCUIT USING PHONONIC BANDGAP STRUCTURE

An encapsulated integrated circuit (100) includes an integrated circuit (IC) die (102). A phonon device (1 10, 111) is fabricated on the IC die (102) that is configured to emit (112) or to receive (113) phonons that have a range of ultrasonic frequencies. An encapsulation material (120) encapsulates...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	REVIER, Daniel, COOK, Benjamin
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!