MOLD RELEASE FILM FOR USE IN MOLD FORMATION AND MOLD FORMATION METHOD

Provided are: a mold release film that is for use in mold formation, and that is characterized by being provided with a mold release layer comprising composition (I) or composition (II) disposed on a base material film; and a mold formation method using same. Composition (I) comprises: a compound (a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SUGIYAMA Ryuichi, TSUJIUCHI Naoki, NAKAGAKI Takamitsu
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are: a mold release film that is for use in mold formation, and that is characterized by being provided with a mold release layer comprising composition (I) or composition (II) disposed on a base material film; and a mold formation method using same. Composition (I) comprises: a compound (a) containing an alkyl group having eight or more carbon atoms; and a crosslinking agent (b). Composition (II) comprises a compound (α) that contains an alkyl group having eight or more carbon atoms and an ethylenically unsaturated group. By this configuration, it is possible to provide an inexpensive mold release film that is for use in mold formation and that exhibits favorable release properties after the hardening of a sealing material in the process of mold formation. L'invention concerne : un film de démoulage qui est destiné à être utilisé dans la formation d'un moule, et qui est caractérisé en ce qu'il est pourvu d'une couche de démoulage comprenant une composition (I) ou une composition (II) disposée sur un film de matériau de base ; et un procédé de formation de moule faisant appel audit film de démoulage. La composition (I) comprend : un composé (a) contenant un groupe alkyle ayant au moins huit atomes de carbone ; et un agent de réticulation (b). La composition (II) comprend un composé (α) qui contient un groupe alkyle ayant au moins huit atomes de carbone et un groupe à insaturation éthylénique. Cette configuration permet d'obtenir un film de démoulage peu coûteux qui est destiné à être utilisé dans la formation d'un moule et qui présente des propriétés de démoulage favorables après le durcissement d'un matériau d'étanchéité au cours du processus de formation de moule. モールド成形に用いられる離型フィルムであって、基材フィルム上に組成物（Ｉ）または組成物（ＩＩ）からなる離型層が設けられていることを特徴とするモールド成形用離型フィルム、およびそれを用いるモールド成形法。組成物（Ｉ）；炭素数８以上のアルキル基を含む化合物（ａ）および架橋剤（ｂ）を含有する組成物。組成物（ＩＩ）；炭素数８以上のアルキル基とエチレン性不飽和基を含む化合物（α）を含有する組成物。モールド成形における封止材硬化後の剥離性が良好なモールド成形用離型フィルムを安価で提供することができる。