HEAT RESISTANT POLYAMIDE COMPOSITION

A heat-resistant polyamide composition includes a copolyamide and an anhydride-functional polymer. The copolyamide includes the reaction product of at least one lactam and a monomer mixture. The monomer mixture includes at least one C32-C40 dimer acid, and at least one C4-C12-diamine. L'inventi...

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Bibliographische Detailangaben
Hauptverfasser:	SPIES, Patrick, HABRAKEN, Gijsbrecht Jacobus Maria
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A heat-resistant polyamide composition includes a copolyamide and an anhydride-functional polymer. The copolyamide includes the reaction product of at least one lactam and a monomer mixture. The monomer mixture includes at least one C32-C40 dimer acid, and at least one C4-C12-diamine. L'invention concerne une composition thermorésistante de polyamide comprenant un copolyamide et un polymère à fonctionnalité anhydride. Le copolyamide comprend le produit de réaction d'au moins un lactame et d'un mélange de monomères. Le mélange de monomères comprend au moins un acide dimère en C32-C40 et au moins une diamine en C4-C12.