PLASMA PROCESSING APPARATUS

A plasma processing apparatus for processing a substrate using a plasma, comprising: a process chamber in which the processing takes place; a plasma source for providing a plasma to the process chamber; a substrate mount within the process chamber for holding the substrate, the substrate mount compr...

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Bibliographische Detailangaben
Hauptverfasser:	BROOKS, Andrew Simon Hall, WOOLLARD, Siobhan Marie, ARESTA, Gianfranco, HENNIGHAN, Gareth, LIONE, Richard Anthony, SINGH, Shailendra Vikram
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A plasma processing apparatus for processing a substrate using a plasma, comprising: a process chamber in which the processing takes place; a plasma source for providing a plasma to the process chamber; a substrate mount within the process chamber for holding the substrate, the substrate mount comprising a surface having a plurality of apertures. La présente invention concerne un appareil de traitement au plasma, destiné à traiter un substrat à l'aide d'un plasma, comprenant : une chambre de traitement dans laquelle a lieu le traitement ; une source de plasma destinée à fournir un plasma à la chambre de traitement ; un support de substrat à l'intérieur de la chambre de traitement destiné à supporter le substrat, le support de substrat comprenant une surface ayant une pluralité d'ouvertures.