PASSIVE DEVICE FOR ELECTRONIC IDENTIFICATION AND METHOD FOR ASSEMBLY THEREOF
The present text of the detailed description, accompanied by illustrative figures, relates to a new passive device and to the method for assembly thereof, intended for the electronic identification of objects based on the UHF-band radiofrequency, consisting of a module composed of a Cl RFID (Radio-F...
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Format: | Patent |
Sprache: | eng ; fre ; por |
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Zusammenfassung: | The present text of the detailed description, accompanied by illustrative figures, relates to a new passive device and to the method for assembly thereof, intended for the electronic identification of objects based on the UHF-band radiofrequency, consisting of a module composed of a Cl RFID (Radio-Frequency IDentification) device connected to an inducer on a semiconductor substrate or insulating substrate by means of reflow assembly process technology with conductive paste, utilizing the characteristics of the actual material to be electronically identified in order to increase the range of communication with an RFID reader.
Le présent brevet comprend la description détaillée, accompagnée de figures illustratives, d'un nouveau dispositif passif et de son procédé de montage, destiné à l'identification électronique d'objets par radiofréquence dans la bande UHF, consistant en un module comprenant un composant CI RFID (Radio-Frequency IDentification) connecté à un inducteur sur substrat semi-conducteur ou isolant, au moyen de la technologie des procédés de montage par refusion avec pâte conductrice, mettant à profit les caractéristiques du propre matériau à identifier par voie électronique en vue d'une augmentation de la distance de communication avec un lecteur RFID.
Trata o presente relatório da descrição detalhada acompanhada de figuras ilustrativas de um novo dispositivo passivo e seu processo de montagem, destinado à identificação eletrônica de objetos a base de radiofrequência na banda UHF, consistindo em um módulo composto por um Cl RFID (Radio-Frequency IDentification) conectado a um indutor em substrato semicondutor ou isolante, por meio da tecnologia de processos de montagem por refusão com pasta condutiva, aproveitando as características do próprio material a ser identificado eletronicamente para aumentar a distância de comunicação com um leitor RFID. |
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