CONTACT FOR TESTING SEMICONDUCTOR DEVICE, AND TEST SOCKET DEVICE

The present invention relates to a contact and a socket device for testing a semiconductor device, and the contact of the present invention is a spring contact integrally formed by punching and bending a metal plate, and comprises an elastic part, which includes various strips of a predetermined pat...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HWANG, Jae Suk
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PHYSICS PUNCHING METAL TESTING TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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