PLATE MATERIAL AND METHOD FOR PRODUCING PLATE MATERIAL

This plate material (1) comprises a clad material (10) which has a thickness of 2 mm or less and which is provided with: a first layer (11) composed of Cu, a Cu alloy, Al or an Al alloy; and a second layer (12) and a third layer (13) that are composed of stainless steel, Ti or a Ti alloy. The clad m...

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Bibliographische Detailangaben
1. Verfasser:	MIYAO, Yukimitsu
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	This plate material (1) comprises a clad material (10) which has a thickness of 2 mm or less and which is provided with: a first layer (11) composed of Cu, a Cu alloy, Al or an Al alloy; and a second layer (12) and a third layer (13) that are composed of stainless steel, Ti or a Ti alloy. The clad material comprises, in the side surfaces (10a, 10b) orthogonal to the lamination direction of the clad material, groove-shaped recessed portions (14, 15) in which the first layer is recessed with respect to the second layer and the third layer. L'invention concerne un matériau de plaque (1) comprenant un matériau de revêtement (10) qui a une épaisseur de 2 mm ou moins et qui est pourvu : d'une première couche (11) composée de Cu, d'un alliage de Cu, d'Al ou d'un alliage d'Al ; et d'une deuxième couche (12) et d'une troisième couche (13) qui sont composées d'acier inoxydable, de Ti ou d'un alliage de Ti. Le matériau de revêtement comprend, dans les surfaces latérales (10a, 10b) orthogonales à la direction de stratification du matériau de revêtement, des parties en retrait en forme de rainure (14, 15) dans lesquelles la première couche est enfoncée par rapport à la deuxième couche et à la troisième couche. この板材（１）は、Ｃｕ、Ｃｕ合金、ＡｌまたはＡｌ合金から構成された第１層（１１）と、ステンレス鋼、ＴｉまたはＴｉ合金から構成された第２層（１２）および第３層（１３）と、を含み、厚みが２ｍｍ以下であるクラッド材（１０）を備える。クラッド材は、クラッド材の積層方向と直交する側面（１０ａ、１０ｂ）において、第２層および第３層に対して第１層が窪む溝状の窪部（１４、１５）を含んでいる。