SENSOR DEVICE HAVING PRINTED CIRCUIT BOARD SUBSTRATE WITH BUILT-IN MEDIA CHANNEL

A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PC...

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Bibliographische Detailangaben
Hauptverfasser:	LARSON, Brent Hans, LANGHANOJA, Shivesh
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS PRINTED CIRCUITS TESTING
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Beschreibung
Zusammenfassung:	A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate. L'invention concerne un dispositif de capteur comprenant un substrat de carte de circuit imprimé (PCB) comportant une surface supérieure, une surface inférieure, une fente entre les surfaces supérieure et inférieure et deux trous pratiqués à travers la surface supérieure et atteignant l'intérieur de la fente. Le dispositif de capteur comprend en outre une puce de capteur, montée sur la surface supérieure du substrat de PCB et au-dessus de l'un des deux trous. Le dispositif de capteur comprend en outre un composé de moulage, recouvrant la puce de capteur et les surfaces de paroi latérale, et la surface supérieure du substrat de PCB.