ADHESIVE-LESS CARRIERS FOR CHEMICAL MECHANICAL POLISHING

Embodiments of the disclosure relate to a system, apparatus and method for polishing thin substrates with high planarity. The apparatus comprises a chemical mechanical polishing head and a plate. The polishing head comprises a bottom surface, a retaining ring, a workpiece-receiving pocket defined be...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUMAR, Niranjan, RAMASWAMI, Seshadri, SUNDARRAJAN, Arvind, BAJAJ, Rajeev, THIRUNAVUKARASU, Sriskantharajah
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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